METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The purpose of the present invention is to improve reliability of a semiconductor device. A semiconductor chip (3) is transferred above a chip loading area (2p1) of a wiring substrate (20) by a bonding jig (30), and then the semiconductor chip (3) and the wiring substrate (20) are electrically connected. The bonding jig (30) loading the semiconductor chip (3) to the wiring substrate (20) has: a maintaining unit (30HD) which absorbs and maintains a logic chip LC; a pressurizing unit (30PR) pushing to the reverse side (3b) of the semiconductor chip (3); and a seal unit (30SL) adhering to a circumference unit of the reverse side (3b) of the semiconductor chip (3). Also, a surface (30b) which adheres to the reverse side (3b) of the semiconductor chip in the seal unit (30SL) is made of a resin.