发明名称 |
BONDING PERFORMANCE INSPECTION METHOD AND BONDING PERFORMANCE INSPECTION APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bonding performance inspection method and a bonding performance inspection apparatus capable of highly accurately inspecting a state of bonding between a plurality of materials without the influence of film thickness irregularity and surface roughness of the bonding target members, and realizing high speed inspection.SOLUTION: Provided are a method of inspecting the bonding performance of bonded portions of a plurality of members of a sample 104 formed by bonding the members together and an apparatus for the same. The method comprises: irradiating a surface of the sample 104 with a pulsed laser beam 111 formed into a thin linear shape for predetermined time to heat the sample 104; imaging the sample 104 irradiated with the laser beam 111 formed thin and heated, for longer time than the predetermined time for heating using an infrared camera 105 to obtain a plurality of thermal images of the surface of the sample 104; detecting a temporal change in a thermal distribution of the surface of the sample 104 from the obtained thermal images; and determining bonding performance of bonded portions from the detected temporal change in the thermal distribution of the surface of the sample 104.</p> |
申请公布号 |
JP2015132545(A) |
申请公布日期 |
2015.07.23 |
申请号 |
JP20140004216 |
申请日期 |
2014.01.14 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
MITSUTA HIROKI;YOSHITAKE YASUHIRO;WATANABE MASAHIRO;NAKAO TOSHIYUKI |
分类号 |
G01N25/72 |
主分类号 |
G01N25/72 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|