发明名称 |
METHOD OF CONVEYING HEAT FROM A LIGHT EMITTING DIODE ASSEMBLY |
摘要 |
A method of conveying heat from a light emitting diode assembly. The method includes providing a light emitting diode assembly having a body that has a substrate with driving circuitry and a plurality of light emitting diodes that produce heat that is conveyed to a heat transfer element. The heat transfer element has a continuously engaged interface with the ceiling of a dwelling when secured. In this manner heat is conveyed from the heat transfer element to the ceiling of the dwelling to dissipate heat from the assembly, thus presenting a light emitting diode assembly with a low profile. |
申请公布号 |
US2015247631(A1) |
申请公布日期 |
2015.09.03 |
申请号 |
US201314429887 |
申请日期 |
2013.09.27 |
申请人 |
ONCE INNOVATIONS ,INC. |
发明人 |
Grajcar Zdenko;Lilly John |
分类号 |
F21V29/74;F21V21/04 |
主分类号 |
F21V29/74 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of conveying heat from a light emitting diode assembly, steps comprising:
providing a light emitting diode assembly having a body with a continuously extending heat transfer element, securing a substrate having driving circuitry and a plurality of light emitting diodes thereon to the body to convey heat from the driving circuitry to the heat transfer element; forming a continuously engaged interface along the entire length of the body between the heat transfer element and a ceiling of a dwelling when securing the light emitting diode assembly to the ceiling of the dwelling; and conveying heat from the heat transfer element to the ceiling of the dwelling to dissipate heat from the assembly. |
地址 |
Plymouth MN US |