发明名称 METHOD OF CONVEYING HEAT FROM A LIGHT EMITTING DIODE ASSEMBLY
摘要 A method of conveying heat from a light emitting diode assembly. The method includes providing a light emitting diode assembly having a body that has a substrate with driving circuitry and a plurality of light emitting diodes that produce heat that is conveyed to a heat transfer element. The heat transfer element has a continuously engaged interface with the ceiling of a dwelling when secured. In this manner heat is conveyed from the heat transfer element to the ceiling of the dwelling to dissipate heat from the assembly, thus presenting a light emitting diode assembly with a low profile.
申请公布号 US2015247631(A1) 申请公布日期 2015.09.03
申请号 US201314429887 申请日期 2013.09.27
申请人 ONCE INNOVATIONS ,INC. 发明人 Grajcar Zdenko;Lilly John
分类号 F21V29/74;F21V21/04 主分类号 F21V29/74
代理机构 代理人
主权项 1. A method of conveying heat from a light emitting diode assembly, steps comprising: providing a light emitting diode assembly having a body with a continuously extending heat transfer element, securing a substrate having driving circuitry and a plurality of light emitting diodes thereon to the body to convey heat from the driving circuitry to the heat transfer element; forming a continuously engaged interface along the entire length of the body between the heat transfer element and a ceiling of a dwelling when securing the light emitting diode assembly to the ceiling of the dwelling; and conveying heat from the heat transfer element to the ceiling of the dwelling to dissipate heat from the assembly.
地址 Plymouth MN US