发明名称 ボンディングワイヤ及びその製造方法
摘要 It is an object of the present invention to provide a bonding wire capable of maintaining a structure and a configuration thereof at the time of performing wire bonding; and a manufacturing method thereof. Provided is a bonding wire having a core member mainly composed of copper; and a palladium coating layer. Particularly, formed in a center of the core member is a fibrous structure with copper crystals extending in an axial direction.
申请公布号 JP5786042(B2) 申请公布日期 2015.09.30
申请号 JP20130555221 申请日期 2013.01.16
申请人 日鉄住金マイクロメタル株式会社 发明人 富樫 亮
分类号 H01L21/60;B21C1/00;C25D7/06 主分类号 H01L21/60
代理机构 代理人
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