| 发明名称 |
SEMICONDUCTOR DEVICE HAVING BONDING PAD |
| 摘要 |
PURPOSE:To prevent cracking at junction time by giving an inclination at the periphery of the hole on the protective film of the junction pad. |
| 申请公布号 |
JPS5399764(A) |
申请公布日期 |
1978.08.31 |
| 申请号 |
JP19770012992 |
申请日期 |
1977.02.10 |
| 申请人 |
HITACHI LTD |
发明人 |
YOSHIMI TAKEO;SAKAI HIDEO |
| 分类号 |
H01L21/60;H01L21/31;H01L29/40;H01L29/41 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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