发明名称 多層基板
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress electromagnetic radiation from a conduction hole to the outside of a substrate in a multilayer substrate having a conduction hole opening to the surface of the substrate. <P>SOLUTION: The multilayer substrate 10 comprises: a ground layer 12 formed on the substrate surface 10a; signal layers 14 and 16 formed in the substrate; and a conduction hole 18 connected electrically with the signal layers 14 and 16 and opening to the substrate surface 10a at a position adjacent to the ground layer 12 in non-contact therewith. The multilayer substrate 10 includes a shielding member 30 installed on the substrate surface 10a to shield the conduction hole 18, and connected electrically with the ground layer 12 while being insulated from the signal layers 14 and 16 and the conduction hole 18. The shielding member 30 exhibits the shield function similarly to the ground layer 12, and suppresses electromagnetic radiation from the conduction hole 18 toward the outside of the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5787605(B2) 申请公布日期 2015.09.30
申请号 JP20110102183 申请日期 2011.04.28
申请人 发明人
分类号 H05K1/02;H05K9/00 主分类号 H05K1/02
代理机构 代理人
主权项
地址