发明名称 |
Semiconductor devices having back side bonding structures |
摘要 |
Semiconductor devices are provided including an internal circuit on a front side of a substrate, the substrate defining a through-silicon via (TSV) structure extending vertically therein; a back side insulating layer on a back side of the substrate; and a back side bonding structure on the back side insulating layer. The TSV structure includes a front side end on a front side of the substrate and contacts the internal circuit and a back side end extending toward a back side of the substrate. The back side bonding structure includes a back side bonding interconnection portion on the back side insulating layer defining a back side bonding via hole therein and a back side bonding via plug portion in the contact plug hole in the back side insulating layer connected to a back side end of the TSV structure. |
申请公布号 |
US9147640(B2) |
申请公布日期 |
2015.09.29 |
申请号 |
US201313957018 |
申请日期 |
2013.08.01 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Lee Woon-Seob;Kang Sin-Woo;Park Yeong-Lyeol;Kim Jang-Ho;Yun Ki-Young |
分类号 |
H01L21/70;H01L23/48;H01L21/768;H01L23/522;H01L23/00 |
主分类号 |
H01L21/70 |
代理机构 |
Myers Bigel Sibley & Sajovec |
代理人 |
Myers Bigel Sibley & Sajovec |
主权项 |
1. A semiconductor device comprising:
an internal circuit on a front side of a substrate, the substrate defining a through-silicon via (TSV) structure extending vertically therein; a back side insulating layer on a back side of the substrate; and a back side bonding structure on the back side insulating layer, wherein the TSV structure includes a front side end on a front side of the substrate and contacts the internal circuit and a back side end extending toward the back side of the substrate; wherein the back side bonding structure comprises a back side bonding interconnection portion on the back side insulating layer defining a back side bonding via hole therein and a back side bonding via plug portion in the back side bonding via hole in the back side insulating layer connected to the back side end of the TSV structure; wherein the back side bonding structure includes a back side bonding interconnection layer and a back side bonding barrier layer; wherein the TSV structure includes a TSV core, a TSV barrier layer surrounding the TSV core, and a TSV liner surrounding the TSV barrier layer, the TSV barrier layer completely surrounding a side and a back side end of the TSV core, and the TSV liner entirely surrounding a side of the TSV barrier layer and partially exposing the TSV barrier layer on the back side end of the TSV core; and wherein the exposed TSV barrier layer is in direct contact with the back side bonding barrier layer. |
地址 |
KR |