| 发明名称 | Power semiconductor assembly and module | ||
| 摘要 | A method and apparatus for assembling a power semiconductor is provided. A device includes a printed circuit board, a heat sink, and a semiconductor chip package. The semiconductor chip package is located between the printed circuit board and the heat sink. A heat-generating surface of the semiconductor chip package is oriented such that the heat-generating surface faces the heat sink. | ||
| 申请公布号 | US9147630(B2) | 申请公布日期 | 2015.09.29 |
| 申请号 | US201313786129 | 申请日期 | 2013.03.05 |
| 申请人 | Infineon Technologies AG | 发明人 | Carletti Andrea |
| 分类号 | H01L23/48;H01L23/34;H01L23/00;H01L23/36;H01L23/40;H01L23/42 | 主分类号 | H01L23/48 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A device comprising: a printed circuit board; an enclosure; a first semiconductor chip package located between the printed circuit board and the enclosure; and a bumper pad located between the printed circuit board and the first semiconductor chip package, wherein the bumper pad pressure mounts the first semiconductor chip package between the enclosure and the printed circuit board, wherein the semiconductor chip package comprises a plurality of pins comprising a portion flush with an upper surface of the bumper pad and bent towards an upper surface of the bumper pad. | ||
| 地址 | Neubiberg DE | ||