Methods for attaching structures using ultraviolet and visible light curing adhesive

摘要

An electronic device may be provided with electronic device structures such as housing structures and structures associated with electrical components. The electronic device structures may be attached to each other using ultraviolet and visible light curable adhesive. A layer of adhesive may be interposed between electronic device structures. A light source may generate ultraviolet light. The structures may include an ultraviolet-light-transparent structure through which the ultraviolet light passes to illuminate and cure the adhesive. The ultraviolet-light-transparent structure may form one of multiple shots of injection molded plastic in a device structure, may be formed using a plastic that is opaque at visible wavelengths, or may have a coating such as a metal coating to help reflect ultraviolet radiation onto the adhesive. Perforations in the coating may be used to pass ultraviolet radiation to the adhesive.

主权项

1. A method, comprising:
forming a two-shot plastic structure using first and second shots of plastic in injection molding equipment, wherein the first shot of plastic comprises ultraviolet-light-transparent plastic; applying adhesive between the two-shot plastic structure and an additional structure, wherein the adhesive is configured to be cured by exposure to at least ultraviolet light; and applying ultraviolet light to the adhesive through the ultraviolet-light-transparent plastic in the two-shot plastic structure to cure the adhesive.