发明名称 Tunnel transistor structure integrated with a resistance random access memory (RRAM) and a manufacturing method thereof
摘要 The invention relates to the technical field of semiconductor memories, in particular to a tunnel transistor structure integrated with a resistance random access memory and a manufacturing method thereof. The tunnel transistor structure in the present invention comprises a semiconductor substrate, and a tunnel transistor and a resistance random access memory formed on the semiconductor substrate, wherein the gate dielectric layer of the tunnel transistor extends to the surface of a drain region of the tunnel transistor; the part of the gate dielectric layer on the surface of the drain region of the tunnel transistor forms the resistance-variable storage layer of the resistance random access memory. In this invention, the high-quality gate dielectric layer of the tunnel transistor and the resistance-variable storage layer of the resistance random access memory are obtained by primary atomic layer deposition which integrates the resistance random access memory and tunnel transistor together without increasing steps. This process is simple and can combine the shallow trench isolation or field oxygen isolation and ion implantation or diffusion of source electrode and drain electrode to make integration convenient.
申请公布号 US9147835(B2) 申请公布日期 2015.09.29
申请号 US201213663180 申请日期 2012.10.29
申请人 FUDAN UNIVERSITY 发明人 Lin Xi;Wang Pengfei;Sun Qingqing;Zhang Wei
分类号 H01L29/76;H01L45/00;H01L27/24 主分类号 H01L29/76
代理机构 Jenkins, Wilson, Taylor & Hunt, P.A. 代理人 Jenkins, Wilson, Taylor & Hunt, P.A.
主权项 1. A tunnel transistor structure integrated with a resistance random access memory (RRAM), comprising: a semiconductor substrate; and a tunnel transistor and a RRAM formed on said semiconductor substrate, wherein a part of a gate dielectric layer of said tunnel transistor extends to a surface of a drain region of said tunnel transistor; wherein the part of the gate dielectric layer on the surface of the drain region of the tunnel transistor forms a resistance-variable storage layer of said RRAM; wherein a first surface of the resistance-variable storage layer of said RRAM is connected to the drain region; and wherein a second surface of the resistance-variable storage layer of said RRAM opposing the first surface is connected to an external drain electrode.
地址 Shanghai CN