Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof

摘要

An integrated circuit packaging system including: a fiber-less organic substrate including: a first dielectric layer, a first metal layer on the first dielectric layer, a second dielectric layer on the first dielectric layer and the first metal layer, and an interconnect via plated on the first metal layer and the second dielectric layer; an integrated circuit mounted over the second dielectric layer; and an integrated circuit interconnect between the integrated circuit and the interconnect via.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a support carrier having a metal barrier; depositing a first dielectric layer on the metal barrier; forming a first metal layer on the first dielectric layer and the metal barrier; depositing a second dielectric layer on the first dielectric layer and the first metal layer; plating an interconnect via on the first metal layer and the second dielectric layer; exposing a system contact from the first dielectric layer, opposite the interconnect via by removing the support carrier; mounting an integrated circuit over the second dielectric layer; and attaching an integrated circuit interconnect between the integrated circuit and the interconnect via.