SEMICONDUCTOR APPEARANCE INSPECTION DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem in which in conjunction with fineness of a wafer of an inspection object, measures have to be taken by increasing the number of processor elements, and the semiconductor appearance inspection device which has to attain low costs by holding down non-inspection areas from image data to reduce position deviation processing loads of the processor elements and suppressing increase in image processing hardware quantity can be a high-costed device.SOLUTION: A semiconductor appearance inspection device 99 has: an image detection unit 8 that detects image data 12 on a wafer 2 from a sensor 5; an amount-of-characteristic calculation unit 13 that calculates an amount of characteristic of the detected image data 12; an image data cut-out unit 17 that sets an inspection area of the image data 12 on the basis of the calculated amount of characteristic; a transmission control unit 19 that transmits transmission data 23 including the set inspection area of the image data 12; and a processor element that uses the transmitted transmission data 23 to perform defect determination processing of the wafer 2.