SUBSTRATE TREATMENT DEVICE, CEILING PART, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

[Problem] To speedily reduce the internal furnace temperature while increasing temperature uniformity in a substrate surface. [Solution] This invention has: a reaction tube for treating the substrate; a heating unit disposed on the outer periphery of the reaction tube, the heating unit heating the interior of the reaction tube; a heat insulation part disposed on the outer periphery of the heating unit; a plurality of channels provided to the heat insulation part, the channels channeling outside air or a cooling medium; and a ceiling part covering the upper surface of the heat insulation part. The ceiling part has: a first member having formed therein a feed port that communicates with the channels and feeds the outside air or the cooling medium to the channels; and a second member disposed on the first member, a space for channeling the outside air or the cooling medium being formed between the second member and the first member, the second member having formed thereon a partition part for dividing the space into at least two spaces.