发明名称 HEATING ELEMENT FOR A PRINTHEAD
摘要 An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.
申请公布号 US2015266293(A1) 申请公布日期 2015.09.24
申请号 US201214397720 申请日期 2012.10.31
申请人 Hewlett-Packard Development Company, L.P. 发明人 Cook Galen P.;Chung Bradley D.;Fuller Anthony M.
分类号 B41J2/14;F22B1/28;B41J2/16 主分类号 B41J2/14
代理机构 代理人
主权项 1. A fluid ejection device, comprising: a substrate; a conductive layer disposed on the substrate, the conductive layer comprising an outer perimeter and an inner region thinner than the outer perimeter, the outer perimeter comprising conductive elements spaced apart from one another; a resistive layer, comprising: an outer resistive portion overlying the conductive elements; anda central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion; and at least one upper layer defining a boundary of a fluid chamber, the boundary aligned vertically above the central resistive portion.
地址 Houston TX US