| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion device capable of preventing sliding of a semiconductor module in a semiconductor laminated unit and suppressing decrease in cooling properties of the semiconductor laminated unit, and a method of manufacturing the same. <P>SOLUTION: There is provided a method of manufacturing a power conversion device 1. The power conversion device 1 comprises a semiconductor laminated unit 10, a frame 2, and a pressurization member 3. The semiconductor laminated unit 10 is formed by laminating a semiconductor module 11 and a cooling tube 121. The frame 2 includes a bottom portion 21 and a front wall portion 221 and a rear wall portion 222. The pressurization member 3 is arranged between the semiconductor laminated unit 10 and the rear wall portion 222 of the frame 2. The power conversion device 1 is configured such that, when the semiconductor laminated unit 10 and the pressurization member 3 are arranged inside the frame 2, a pressurization direction of the pressurization member 3 is inclined toward the bottom portion 21 at least at the time of start of pressurization power application, when pressurization power of the pressurization member 3 is started to be applied to the semiconductor laminated unit 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
