| 发明名称 |
POWER MODULE PACKAGE |
| 摘要 |
There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil. |
| 申请公布号 |
US2015270217(A1) |
申请公布日期 |
2015.09.24 |
| 申请号 |
US201514661844 |
申请日期 |
2015.03.18 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Kwang Soo;KWAK Young Hoon;HONG Chang Seob;CHAE Joon Seok;UM Kee Ju |
| 分类号 |
H01L23/522;H01L25/065;H01L23/367 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power module package, comprising:
a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil. |
| 地址 |
Suwon-si KR |
