| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
An embodiment of a printed circuit board includes: a mounting board with a solder resist on a front surface thereof; a component mounted on the mounting board; an underfill material that fixes the component to the mounting board; and resin materials dotted between the solder resist and the underfill material. |
| 申请公布号 |
US2015271928(A1) |
申请公布日期 |
2015.09.24 |
| 申请号 |
US201514728819 |
申请日期 |
2015.06.02 |
| 申请人 |
FUJITSU Limited |
发明人 |
TAKESUE Masakazu |
| 分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A manufacturing method of a printed circuit board, comprising:
dotting resin materials on a solder resist on a front surface of a mounting board; mounting a component on the mounting board; and providing an underfill material that fixes the component to the mounting board in a gap between the mounting board and the component and in a gap between the resin materials and the component. |
| 地址 |
Kawasaki-shi JP |
