| 摘要 |
Composition comprising, by weight, the total being equal to 100%: from 98% to 100% of at least one copolyamide comprising amide units and polyether units, having a melting point (Mp) from approximately 90 to approximately 150°C, in particular from approximately 100°C to approximately 125°C, and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); - from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof, for the manufacture of a heat-sensitive adhesive, in particular a web, a film, granules, a filament, a grid, a powder or a suspension. |
