发明名称 BACKPLANE FOR RECEIVING ELECTRICAL COMPONENTS
摘要 A backplane configured to receive electrical components is provided. The backplane in one example includes a substrate comprising an at least partially flexible material, a plurality of backplane traces formed as part of the substrate, at least one connector island formed in the substrate, with the at least one connector island located in an opening in the substrate and configured to receive at least one mating electrical component, and one or more spring elements bridging between the at least one connector island and the substrate, with traces of the plurality of backplane traces extending over the one or more spring elements to the at least one connector island and with the one or more spring elements allowing the at least one connector island to flex with respect to the substrate and absorb vibrations.
申请公布号 US2015268701(A1) 申请公布日期 2015.09.24
申请号 US201414218117 申请日期 2014.03.18
申请人 HGST Netherlands B.V. 发明人 Huang Lidu;Hirano Toshiki;Wilke Jeffrey;Ou-Yang Jin Hui;Bell Michael
分类号 G06F1/18 主分类号 G06F1/18
代理机构 代理人
主权项 1. A backplane configured to receive electrical components, comprising: a substrate comprising an at least partially flexible material; a plurality of backplane traces formed as part of the substrate; at least one connector island formed in the substrate, with the at least one connector island located in an opening in the substrate and configured to receive at least one mating electrical component; and one or more spring elements bridging between the at least one connector island and the substrate, with traces of the plurality of backplane traces extending over the one or more spring elements to the at least one connector island and with the one or more spring elements allowing the at least one connector island to flex with respect to the substrate and absorb vibrations.
地址 Amsterdam NL