| 摘要 |
The embodiments of the present invention disclose a mobile terminal and relate to the technical field of terminals; the invention is capable of improving chip heat dissipation performance, reducing the temperature of the chip. The mobile terminal comprises a circuit board, the first side of said circuit board being provided with a chip, and the second side of said circuit board being provided with a groove; the mobile terminal further comprising: a heat pipe, arranged in said groove, one end of said heat pipe extending to the side wall of said circuit board or to outside the side wall of said circuit board. |
