发明名称 Noise Suppression Circuit Board Design For An Inductive Heater
摘要 A noise suppression circuit board design to provide a power supply to an inductive heating element is disclosed. The noise suppression circuit provides a configuration for a multi-layer circuit board that has radiation noise emissions below the CISPR 11 (limits and methods of measurements of radio disturbance characteristics of industrial, scientific and medical (ISM) radio-frequency equipment) thresholds in the 30 MHz to 1 GHz frequency range.
申请公布号 US2015271912(A1) 申请公布日期 2015.09.24
申请号 US201414223668 申请日期 2014.03.24
申请人 Tetsuo Yokoyama;Masashi Sanamoto 发明人 Tetsuo Yokoyama;Masashi Sanamoto
分类号 H05K1/02;H05K1/11;H05K1/09;H05K1/18 主分类号 H05K1/02
代理机构 代理人
主权项 1. A circuit board design for an inductive heater assembly, comprising: a multilayer circuit board for mounting a plurality of circuit components, the multilayer circuit board including: a top layer consisting of an etched copper foil on a core coated with an insulation layer, said top layer having a plurality of circuit trace lines and a plurality of vias, said top layer further including a plurality of ground cut lines etched through said copper foil to segregate the ground portions of the copper foil into zones for mounting respective circuit components;at least one middle layer on a core including a plurality of vias matching the plurality of vias of said top layer; anda bottom layer consisting of an etched copper foil on a core coated with an insulation layer, said bottom layer having a plurality of circuit trace lines and a plurality of vias, said plurality of vias matching the plurality of vias of said top layer, said bottom layer further including a plurality of ground cut lines etched through said copper foil to segregate the ground portions of the copper foil into zones.
地址 Osaka JP