发明名称 |
Noise Suppression Circuit Board Design For An Inductive Heater |
摘要 |
A noise suppression circuit board design to provide a power supply to an inductive heating element is disclosed. The noise suppression circuit provides a configuration for a multi-layer circuit board that has radiation noise emissions below the CISPR 11 (limits and methods of measurements of radio disturbance characteristics of industrial, scientific and medical (ISM) radio-frequency equipment) thresholds in the 30 MHz to 1 GHz frequency range. |
申请公布号 |
US2015271912(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
US201414223668 |
申请日期 |
2014.03.24 |
申请人 |
Tetsuo Yokoyama;Masashi Sanamoto |
发明人 |
Tetsuo Yokoyama;Masashi Sanamoto |
分类号 |
H05K1/02;H05K1/11;H05K1/09;H05K1/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A circuit board design for an inductive heater assembly, comprising:
a multilayer circuit board for mounting a plurality of circuit components, the multilayer circuit board including:
a top layer consisting of an etched copper foil on a core coated with an insulation layer, said top layer having a plurality of circuit trace lines and a plurality of vias, said top layer further including a plurality of ground cut lines etched through said copper foil to segregate the ground portions of the copper foil into zones for mounting respective circuit components;at least one middle layer on a core including a plurality of vias matching the plurality of vias of said top layer; anda bottom layer consisting of an etched copper foil on a core coated with an insulation layer, said bottom layer having a plurality of circuit trace lines and a plurality of vias, said plurality of vias matching the plurality of vias of said top layer, said bottom layer further including a plurality of ground cut lines etched through said copper foil to segregate the ground portions of the copper foil into zones. |
地址 |
Osaka JP |