| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide protection tape peeling method and device that can peel off a protection tape from a wafer at low cost with no peeling tape, and simplify the peeling work of the protection tape.SOLUTION: A protection tape peeling method for peeling a protection tape (14) from the surface (11) of a wafer (W) having a notch (13) comprises: a suction and holding step for sucking and holding the back surface (12) of the wafer by a holding table (2); a protection tape floating step of spraying air from the outside of the wafer to the notch to float the protection tape at the notch portion from the surface of the wafer; a protection tape gripping step for griping one end of the floated protection tape by a griping unit (5); and a protection tape peeling step for moving the griping unit (5) from one end of the protection tape to the other end relatively to the holding table.</p> |
