发明名称 FREE ABRASIVE GRAIN PROCESSING WIRE AND WIRE SAW
摘要 <p>PROBLEM TO BE SOLVED: To provide a free abrasive grain processing wire and a wire saw that improve slurry supply to a workpiece processing position and raise a speed of free abrasive grains in a slurry at a workpiece cutting position.SOLUTION: In a free abrasive grain processing wire 1, a hollow hole 3 is formed in a wire material 2 of circular cross section, and many holes 4 through which abrasive grains can pass are formed in the outer peripheral surface of the wire material 2 to make the many holes 4 communicate with the hollow hole 3. A wire saw that presses a workpiece to the free abrasive grain processing wire 1 to cut the workpiece is provided with a supply chamber at a running position of the free abrasive grain processing wire 1. The supply chamber is supplied with slurry in the interior of a storage tank by means of a pump to make the slurry actively flow into the hollow hole 3 from the many holes 4, so that the slurry and free abrasive grains in the slurry are supplied to a cutting position of the workpiece by the running of the free abrasive grain processing wire 1.</p>
申请公布号 JP2015166120(A) 申请公布日期 2015.09.24
申请号 JP20140041194 申请日期 2014.03.04
申请人 KOMATSU NTC LTD 发明人 SUGIHARA TSUTOMU
分类号 B24B27/06;B23D61/18;B28D5/04;H01L21/304 主分类号 B24B27/06
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