发明名称 |
PACKAGED MICROSYSTEMS |
摘要 |
A sub-millimeter packaged microsystem includes a microsystem located in a sealed cavity defined between first and second portions of a micropackage. One or both micropackage portions can be fabricated from a metal suitable for use in a harsh environment, such as an oil well environment. The microsystem includes electronic components and can be configured to communicate with external components through a wall of the micropackage by wireless communication or by conductive feedthroughs. Pluralities of microsystems, first micropackage portions, and/or second micropackage portions are simultaneously placed during a batch assembly process. The assembly process may include micro-crimping the first and second micropackaging portions together without the need for bonding materials and related process steps. |
申请公布号 |
WO2015142949(A1) |
申请公布日期 |
2015.09.24 |
申请号 |
WO2015US21100 |
申请日期 |
2015.03.17 |
申请人 |
THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
发明人 |
GIANCHANDANI, YOGESH;LI, TAO;MA, YESHU |
分类号 |
B81B7/00;B81C3/00;H01L23/043;H01L23/053 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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