| 发明名称 |
INTEGRATED CIRCUIT ARRANGEMENT |
| 摘要 |
An integrated circuit arrangement comprising a substrate and a flange disposed on top of the substrate. The flange comprises a cantilever portion configured to project over the substrate. A die disposed on top of the flange. A first output terminal disposed on the substrate. A first lead configured to provide for an electrical connection between the die and the first output terminal. A first electrically conducting member configured to provide at least part of a current return path between the substrate and the die and arranged to bridge a gap between the cantilever portion and the substrate. The first electrically conducting member is disposed between the die and the first output terminal and is configured to enable electrical current to flow from the substrate to the cantilever portion of the flange. |
| 申请公布号 |
US2015270198(A1) |
申请公布日期 |
2015.09.24 |
| 申请号 |
US201514658479 |
申请日期 |
2015.03.16 |
| 申请人 |
NXP B.V. |
发明人 |
Cuoco Vittorio;van Zuijlen Albert;van der Zanden Josephus |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit arrangement, for use with a substrate, comprising:
a flange for disposition on top of the substrate, the flange comprising a cantilever portion configured to project over the substrate;a die disposed on top of the flange;
a first lead configured to provide for an electrical connection between the die and a first output terminal disposed on the substrate;a first electrically conducting member configured to provide at least part of a current return path between the substrate and the die and arranged to bridge a gap between the cantilever portion and the substrate. |
| 地址 |
Eindhoven NL |
