CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION FOR THICK-FILM APPLICATION

摘要

A chemically amplified positive-type photosensitive resin composition for thick-film application capable of forming a resist pattern having a nonresist section with a good rectangular cross-sectional shape under a low exposure level even when a resist pattern having a film thickness of 10 μm or more is formed. A chemically amplified positive-type photosensitive resin composition for thick-film application comprising an acid generator and an organic solvent, in which an acrylic resin is added that contains a constituent unit derived from an acrylic acid ester comprising an —SO2— containing cyclic group or a lactone-containing cyclic group as a resin whose solubility in alkali increases under the action of acid.

主权项

1. A chemically amplified positive-type photosensitive resin composition, comprising:
(A) an acid generator that produces an acid by being irradiated with an active ray or radiation; (B) a resin whose solubility in alkali increases under the action of acid; and (S) an organic solvent, wherein the resin (B) comprises an acrylic resin (B-3) comprising a constituent unit derived from an acrylic acid ester comprising an —SO2-containing cyclic group or a lactone-containing cyclic group, and the percentage of the acrylic resin (B-3) to the total mass of resin components contained in the composition is 70% by mass or more.