| 发明名称 |
APPARATUS AND METHOD FOR INDIRECTLY COOLING SUPERCONDUCTING QUANTUM INTERFERENCE DEVICE |
| 摘要 |
An apparatus and a method for indirectly cooling a superconducting quantum interference device (SQUID) are provided. The apparatus includes an outer container extending in a vertical direction; a metallic inner container inserted into the outer container to store a liquid coolant, the metal inner container including a top plate; a SQUID sensor module disposed between a bottom surface of the outer container and a bottom surface of the inner container; a heat transfer pillar adapted to cool the SQUID sensor module, the heat transfer pillar having one end connected to the bottom surface of the inner container and the other end directly or indirectly connected to the SQUID sensor module; a magnetic shield part formed of a superconductor covering a top surface of the SQUID sensor module; and a heat conduction plate being in thermal contact with the other end of the heat transfer pillar. |
| 申请公布号 |
US2015268311(A1) |
申请公布日期 |
2015.09.24 |
| 申请号 |
US201514692258 |
申请日期 |
2015.04.21 |
| 申请人 |
KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE |
发明人 |
Yu Kwon-Kyu;Lee Yong-Ho;Kim Kiwoong;Kwon Hyukchan;Kim Jin-Mok;Lee Sang-Kil |
| 分类号 |
G01R33/00;H01L39/02;H01L23/367;G01R1/18;G01R33/035;H01L23/473 |
主分类号 |
G01R33/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for indirectly cooling a superconducting quantum interference device (SQUID), comprising:
an outer container extending in a vertical direction; a metallic inner container inserted into the outer container to store a liquid coolant, the metal inner container including a top plate; a SQUID sensor module disposed between a bottom surface of the outer container and a bottom surface of the inner container; a heat transfer pillar adapted to cool the SQUID sensor module, the heat transfer pillar having one end connected to the bottom surface of the inner container and the other end directly or indirectly connected to the SQUID sensor module; a magnetic shield part formed of a superconductor covering a top surface of the SQUID sensor module; and a heat conduction plate being in thermal contact with the other end of the heat transfer pillar, the heat conduction plate being stacked on a top surface of the magnetic shield part, wherein the inner container has a space spaced apart from the outer container and a space between the inner container and the outer container is in a vacuum state. |
| 地址 |
Daejeon KR |
