ANISOTROPIC CONDUCTIVE ADHESIVE AGENT

摘要

Provided is an anisotropic conductive adhesive agent with which it is possible to obtain high heat-dissipation properties. The present invention contains: conductive particles (31) in which a conductive metal layer is formed on the surface of resin particles; solder particles (32) having a smaller average size than the conductive particles; and a binder in which the conductive particles (31) and the solder particles (32) are dispersed. The conductive particles (31) are deformed into a flat shape by being pressed during crimping, thereby electrically connecting terminals. Moreover, the terminals are solder joined by means of the solder particles (32) having a smaller average size than the conductive particles (31). As a consequence, the contact area between opposing terminals increases and it is possible to obtain high heat-dissipation properties.