THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

A method for manufacturing a printed circuit board according to an embodiment of the present invention includes the steps of: preparing an insulation plate; forming a first metal layer which is a plating seed layer on the prepared insulation plate; forming a dry film with an opening part to expose the partial surface of the first metal layer on the first metal layer; forming a second metal layer to fill the opening part on the first metal layer which is exposed by taking the first metal layer as a seed layer; forming a third metal layer on the second metal layer; removing the dry film; and forming a pad which is composed of the first metal layer, the second metal layer, and the third metal layer by removing the first metal layer of the remaining region except a region with the second metal layer and the third metal layer.