| 摘要 |
The present invention relates to a hot-melt adhesive with a softening point of 105-110°C containing an EVA copolymer, a hydrocarbon resin, a microcrystalline wax, a Fischer-Tropsch wax, wherein the EVA copolymer has a 28% vinyl acetate content and a melt flow index greater than 400. The described adhesive allows reducing the amount of adhesive applied when gluing cardboard articles together, and energy savings are therefore achieved when gluing. The described adhesive is suitable for attaching cardboard, paper or wax paper substrates to one another. |
