| 摘要 |
An apparatus comprising a flexible substrate 201 and an overhanging electronic component island 202a wherein the rigid electronic component island comprises a substrate-face with a connection portion 221a and an overhang portion 222a, the connection portion being mechanically coupled to a surface of the flexible substrate via one or more central connection-support pad 203a and the overhang portion configured to overhang and be substantially free of the underlying flexible substrate such that the underlying flexible substrate can be strained independently from the overhang portion under operational strains of the flexible substrate. The central connection pad also removes stress within the components on the island. This connection mechanism allows adjacent component islands to overlap one another. |
