METHOD FOR MANUFACTURING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

摘要

One embodiment of the present invention provides a method for manufacturing a circuit board, which includes the steps of: preparing a circuit board body which includes a core insulation layer which has a first surface and a second surface facing the first surface and a first conductive thin film layer which is arranged on the first surface and includes a convex part which is buried in the core insulation layer; forming a cavity corresponding to the convex part on the first surface by removing the convex part; and forming a first wiring pattern on the first surface.