| 发明名称 | Heating device, fixing device, and image forming apparatus | ||
| 摘要 | Provided is a heating device that heats a belt which transports a medium on which a non-fixed image to be fixed onto the medium through heating is formed, the heating device including a heating element, a first insulating layer and a second insulating layer that are arranged to nip the heating element, a first supporting layer that comes into contact with the first insulating layer and a second supporting layer that comes into contact with the second insulating layer, both of which are arranged to nip the first insulating layer, the heating element, and the second insulating layer, and a connection member that connects the first supporting layer and the second supporting layer in a normal direction of the first supporting layer and the second supporting layer. | ||
| 申请公布号 | US9141053(B2) | 申请公布日期 | 2015.09.22 |
| 申请号 | US201414273023 | 申请日期 | 2014.05.08 |
| 申请人 | FUJI XEROX CO., LTD. | 发明人 | Matsumoto Mitsuhiro;Uehara Yasuhiro;Ito Kazuyoshi;Ohara Hideaki;Saiki Mikio;Murakami Hiroki;Kawakami Kimiyuki;Okada Junji;Suto Tadashi |
| 分类号 | G03G15/20 | 主分类号 | G03G15/20 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A heating device that heats a belt which transports a medium on which a non-fixed image to be fixed onto the medium through heating is formed, the heating device comprising: a heating element; a first insulating layer and a second insulating layer that are arranged to nip the heating element; a first supporting layer that comes into contact with the first insulating layer and a second supporting layer that comes into contact with the second insulating layer, both of which are arranged to nip the first insulating layer, the heating element, and the second insulating layer; and a connection member that is configured to connect the first supporting layer and the second supporting layer in a normal direction of the first supporting layer and the second supporting layer, wherein the connection member is configured to connect the first supporting layer and the second supporting layer in the normal direction of the first supporting layer and the second supporting layer in an area where the heating element is absent, wherein the connection member is configured to not connect the first supporting layer and the second supporting layer in the normal direction of the first supporting layer and the second supporting layer in an area here the heating element is present. | ||
| 地址 | Tokyo JP | ||