发明名称 |
Magnetic tunnel junction and method for fabricating a magnetic tunnel junction |
摘要 |
An improved magnetic tunnel junction device and methods for fabricating the improved magnetic tunnel junction device are provided. The provided two-etch process reduces etching damage and ablated material redeposition. In an example, provided is a method for fabricating a magnetic tunnel junction (MTJ). The method includes forming a buffer layer on a substrate, forming a bottom electrode on the substrate, forming a pin layer on the bottom electrode, forming a barrier layer on the pin layer, and forming a free layer on the barrier layer. A first etching includes etching the free layer, without etching the barrier layer, the pin layer, and the bottom electrode. The method also includes forming a top electrode on the free layer, as well as forming a hardmask layer on the top electrode. A second etching includes etching the hardmask layer; the top electrode layer, the barrier layer, the pin layer, and the bottom electrode. |
申请公布号 |
US9142762(B1) |
申请公布日期 |
2015.09.22 |
申请号 |
US201414229427 |
申请日期 |
2014.03.28 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
Li Xia;Lee Kangho;Chen Wei-Chuan;Lu Yu;Park Chando;Kang Seung Hyuk |
分类号 |
H01L21/00;H01L43/12;H01L43/08;H01L27/22 |
主分类号 |
H01L21/00 |
代理机构 |
Muncy, Geissler, Olds & Lowe, P.C. |
代理人 |
Muncy, Geissler, Olds & Lowe, P.C. |
主权项 |
1. A method for fabricating a device, comprising:
fabricating a magnetic tunnel junction, including:
forming a bottom electrode on a substrate;forming a pin layer on the bottom electrode;forming a barrier layer on the pin layer;forming a free layer on the barrier layer;etching the free layer, without etching the barrier layer, the pin layer, and the bottom electrode;forming a top electrode on the free layer;forming a hardmask layer on the top electrode; andetching the hardmask layer; the top electrode, the barrier layer, the pin layer, and the bottom electrode. |
地址 |
San Diego CA US |