SUBSTRATE HEATING UNIT AND SUBSTRATE PROCESSING APPARATUS USING THE SAME

摘要

A substrate heating unit and a substrate treatment apparatus using the same are disclosed. According to the present invention, a control plate having a same heat transfer coefficient with a heating plate, and having a smaller heat transfer coefficient than the heating plate is installed in a portion of the heating plate corresponding to a portion of a substrate having a relatively high temperature among the portions of the substrate. Then, calories dissipated towards the portion of the substrate having a relatively high temperature are reduced to evenly control the temperature of the entire portions of the substrate. As such, a film having an even thickness can be formed along an entire portion of the substrate; and moreover, the temperature of the substrate is controlled using the control plate of a substrate heating unit to evenly control the temperature of the entire portion of the substrate when a heat source is provided in an RF coil.