| 摘要 |
Embodiments of the present invention relate to a method for assembling an integrated circuit package. In the embodiments, the method may include providing a wafer having an unpatterned passivation layer to prevent collision of metal conductors embedded in the wafer. The method may further include laminating a dielectric material on the passivation layer to form a dielectric layer, and selectively removing the dielectric material to form voids on the dielectric layer. The voids may reveal portions of the passivation layer disposed on the metal conductors. The method may then involve removing the portions of the passivation layer to reveal the metal conductors. Other embodiments may be described and/or claimed. |
