具有粒子于聚合基质内之ＣＭＰ多孔垫及藉其抛光基板之方法,申请号TW099112927-传众专利搜索

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发明名称	具有粒子于聚合基质内之ＣＭＰ多孔垫及藉其抛光基板之方法
摘要
申请公布号	TWI500480	申请公布日期	2015.09.21
申请号	TW099112927	申请日期	2010.04.23
申请人	卡博特微电子公司	发明人	李守田;法凯西　罗伯;卡苏里　嘉仙卡
分类号	B24B37/24;B24D3/28	主分类号	B24B37/24
代理机构		代理人	陈长文台北市松山区敦化北路201号7楼
主权项	一种化学机械抛光垫，其包括一聚合基质及0.1-15wt.%的金属氧化物粒子，其中该垫具有孔隙，该金属氧化物粒子系均匀地分布遍及该孔隙中，且该金属氧化物粒子具有25m2/g至450m2/g的比表面积，且其中该聚合基质包含热塑性聚胺基甲酸酯。
地址	美国

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