| 摘要 |
FIELD: process engineering.SUBSTANCE: claimed invention relates to thermo-photoelectric converters with micro gap (MTPV) for solid-state heat-to-electricity converters. It consists in creation and maintenance of miniature distance between two bodies in submicron gap for perfection of conversion. Whilst submicron gap can be reached, thermal effects on hot and cold surfaces stimulate crosswise oscillation, twisting or straining of elements in said gap which causes uncontrolled variations at power output. Primary consideration in designing is assumption of decrease in contact between emitter chips and shell inner surface to allow a goof heat transfer. Photoelectric voltaic elements are directed towards emitter chips to press them against said inner wall.EFFECT: high temperature of heat surface material improves heat transfer between shell surface and emitter chip.19 cl, 13 dwg |
