发明名称 |
Halo-hydrocarbon polymer coating |
摘要 |
<p>HALO-HYDROCARBON POLYMER COATING In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating. clcc C:C:J co C cc C'Y)</p> |
申请公布号 |
AU2014202320(B2) |
申请公布日期 |
2015.09.17 |
申请号 |
AU20140202320 |
申请日期 |
2014.04.29 |
申请人 |
SEMBLANT LIMITED |
发明人 |
HUMPHRIES, MARK ROBSON;FERDINANDI, FRANK;SMITH, RODNEY EDWARD |
分类号 |
H05K3/28;C12Q1/00;H01H13/70;H01L23/485;H05K3/34 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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