PREDICTING LED PARAMETERS FROM ELECTROLUMINESCENT SEMICONDUCTOR WAFER TESTING

摘要

A diode model and conductive-probe measurements taken at the wafer lever are used to predict the characterization parameters of a semiconductor device manufactured from the wafer. A current-voltage curve (I-V) model that expresses a current-voltage relationship as a function of resistance, ideality factor, and reverse saturation current is fitted to a number of conductive-probe measurement data. The current-voltage curve (I-Vd) for the device is then estimated by subtracting from the (I-V) model the product of current times the resistance produced by fitting the (I-V) model.

主权项

1. A method of characterizing a semiconductor device from conductive-probe measurements performed on a semiconductor wafer from which the device is manufactured, said wafer including a p-type semiconductor layer and an n-type semiconductor layer defining a p-n junction, the method comprising the following steps:
applying electrical stimuli to the p-n junction through a probe in direct contact with one of said semiconductor layers to produce conductive-probe measurement data; fitting a current-voltage curve (I-V) model to said conductive-probe measurement data, said model expressing a current-voltage relationship as a function of resistance; and estimating a current-voltage curve (I-Vd) for the device by removing from the (I-V) model resistance effects calculated from data generated by the fitting step.