| 摘要 |
According to an embodiment, a semiconductor device includes a first conductive plate having a semiconductor chip mounted thereon, and a second conductive plate that overlaps the semiconductor chip and at least two sides of the first conductive plate. In some embodiments, the semiconductor chip includes a source electrode, a drain electrode, and a gate electrode, and the first conductive plate includes a first terminal electrically connected to the drain electrode and a second terminal electrically connected to the gate electrode; a third terminal on the second conductive plate is provided on the at least two sides and electrically connected to the source electrode. |
