| 摘要 |
The purpose of the present invention is to provide: a polishing pad having a high polishing rate and excellent planarizing properties; and a method for producing the polishing pad. A polishing pad having, formed therein, a polishing layer comprising a polyurethane resin foam, said polishing pad being characterized in that a polyurethane resin, which is a material used for forming the polyurethane resin foam, has an alkoxysilyl group introduced into a side chain thereof, wherein the introduction of the alkoxysilyl group is achieved by the reaction of a urethane or urea group in an isocyanate-terminal prepolymer with an isocyanate group in an alkoxysilyl-group-containing isocyanate represented by general formula (1). (In the formula, X represents OR1 or OH; R1's independently represent an alkyl group having 1 to 4 carbon atoms; and R2 represents an alkylene group having 1 to 6 carbon atoms.) |
