| 摘要 |
<p>A photosensor simplifies the resin molding process for an emitter element (11), a receiver element (16), and a luminous element (42) forming an operation indicator lamp. The photosensor includes an emitter element (11), an emitter-encapsulating portion (12), a receiver element (16), a receiver-encapsulating portion (17), a circuit portion (40), and a circuit-encapsulating portion (90). The emitter-encapsulating portion (12) encapsulates the emitter element (11). The receiver-encapsulating portion (17) encapsulates the receiver element (16). The circuit portion (40) includes a luminous element (42) for indicating an operation. The circuit-encapsulating portion (90) encapsulates the circuit portion. The circuit-encapsulating portion includes an operation indicator (92) portion facing the luminous element. The emitter-encapsulating portion (12), the receiver-encapsulating portion (17), and the circuit-encapsulating portion (90) are connected to one another with a conductive leadframe (8). The emitter-encapsulating portion (12), the receiver-encapsulating portion (17), and the circuit-encapsulating portion (90) are formed from the same resin material containing a light diffusing agent.</p> |
