发明名称 PROCESSING METHOD OF PLATE-LIKE OBJECT
摘要 The present invention aims to provide a method for processing a plate-shaped object which can remove a laminate to expose a substrate without damaging the substrate in a plate-shaped object comprising the substrate and the laminate formed on the substrate. In the method for processing the plate-shaped object which processes the plate-shaped object comprising the substrate and the laminate formed on the substrate, a substrate exposure process which removes the laminate to expose the substrate by radiating a laser beam set to have an energy density which does not damage the substrate but the laminate to an area where a user wants to remove the laminate of the plate-shaped object is performed.
申请公布号 KR20150105210(A) 申请公布日期 2015.09.16
申请号 KR20150026537 申请日期 2015.02.25
申请人 DISCO CORPORATION 发明人 OGAWA YUKI;ISHIDA YUKI;OBATA TSUBASA
分类号 H01L21/78;H01L21/268;H01L23/00 主分类号 H01L21/78
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