发明名称 |
PROCESSING METHOD OF PLATE-LIKE OBJECT |
摘要 |
The present invention aims to provide a method for processing a plate-shaped object which can remove a laminate to expose a substrate without damaging the substrate in a plate-shaped object comprising the substrate and the laminate formed on the substrate. In the method for processing the plate-shaped object which processes the plate-shaped object comprising the substrate and the laminate formed on the substrate, a substrate exposure process which removes the laminate to expose the substrate by radiating a laser beam set to have an energy density which does not damage the substrate but the laminate to an area where a user wants to remove the laminate of the plate-shaped object is performed. |
申请公布号 |
KR20150105210(A) |
申请公布日期 |
2015.09.16 |
申请号 |
KR20150026537 |
申请日期 |
2015.02.25 |
申请人 |
DISCO CORPORATION |
发明人 |
OGAWA YUKI;ISHIDA YUKI;OBATA TSUBASA |
分类号 |
H01L21/78;H01L21/268;H01L23/00 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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