电浆处理装置及晶圆搬送用托盘;PLASMA PROCESSING APPARATUS AND WAFER TRANSFER TRAY

摘要

本发明之电浆处理装置包含：晶圆搬送用托盘，其具有第1面及与上述第1面相反之第2面，且于上述第1面保持晶圆；冷却部，其冷却上述晶圆搬送用托盘；导电性之支持体，其支持上述晶圆搬送用托盘之上述第2面；及两面静电吸附部，其将上述晶圆静电吸附于上述晶圆搬送用托盘之上述第1面，并将上述支持体静电吸附于上述晶圆搬送用托盘之上述第2面。; a cooler cooling the wafer transfer tray; a conductive supporter supporting the second surface of the wafer transfer tray; and a double-surface electrostatic attractor electrostatically attracting the wafer to the first surface of the wafer transfer tray and electrostatically attracting the supporting body to the second surface of the wafer transfer tray.