发明名称 CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <p>The present invention relates to a chip electronic component and a manufacturing method thereof. More specifically, the present invention relates to a chip electronic component which has excellent dispersion characteristics of the magnetic powder to improve the filling factor and inductance and a manufacturing method thereof.</p>
申请公布号 KR20150105087(A) 申请公布日期 2015.09.16
申请号 KR20140027291 申请日期 2014.03.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HAN, JIN OK;PARK, MOON SOO;KIM, TAE YOUNG
分类号 H01F17/00;H01F41/04 主分类号 H01F17/00
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