| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition that further improves surface characteristics of a silicon wafer after finish/polishing. <P>SOLUTION: The polishing composition contains a diamine compound including an alkyl diamine structure having two nitrogens represented by formula (1), wherein at least one block type polyether is bonded to the two nitrogens of the alkyl diamine structure; and the block type polyether comprises a diamine compound obtained by bonding an oxyethylene group and an oxypropyrene group, a compound having a polyalkylene glycol structure, and a water-soluble macromolecular compound. In formula (1), R represents an alkylene group represented by C<SB>n</SB>H<SB>2n</SB>and (n) is an integer equal to or larger than 1. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
