Universal direct docking at probe test

摘要

Techniques are described to provide a universal direct docking tester to prober interface between the test head and a prober of semiconductor wafer prober for testing die within semiconductor wafers. In an implementation, a universal direct docking tester to prober interface includes a tray assembly configured to be mounted within an opening of the prober housing and a stiffener assembly configured to be mounted to a test head to support a load board PCB that includes a probe head. The stiffener assembly includes a skirt that is received in the tray assembly when the test head is interfaced with the prober to position the load board PCB within the prober to facilitate engagement of the probe head with the wafer.

主权项

1. A universal direct docking tester to prober interface comprising:
a tray assembly configured to be mounted within an opening of a prober, the prober including a wafer chuck configured to receive a semiconductor wafer; and a stiffener assembly configured to be mounted to a test head to support a load board PCB having a probe head operable to test one or more integrated circuits included in the semiconductor wafer, the stiffener assembly including a skirt configured to be received in the tray assembly when the test head is interfaced with the prober to position the load board PCB within the prober for engagement of the probe head with the semiconductor wafer, where the skirt extends around the periphery of the stiffener assembly, and where the skirt includes at least one flange that is configured to be received against an inner lip of a tray assembly frame and to be secured to the tray assembly frame by at least one receiving member.