发明名称 |
Structure and fabrication method of a sensing device |
摘要 |
A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire. |
申请公布号 |
US9133018(B2) |
申请公布日期 |
2015.09.15 |
申请号 |
US200912572277 |
申请日期 |
2009.10.02 |
申请人 |
Industrial Technology Research Institute |
发明人 |
Chen Lung-Tai;Hsu Yu-Wen;Chen Sheah;Lin Jing-Yuan;Pan Li-Chi;Ho Tzong-Che |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
Lin & Associates IP, Inc. |
代理人 |
Lin & Associates IP, Inc. |
主权项 |
1. A structure of a sensing device, comprising:
a substrate having an upper surface; a sensor member located at a center area of said upper surface of said substrate; a standing-ring member located on said upper surface of said substrate and surrounding said sensor member; and at least an external conductive wire located on said upper surface of said substrate, said standing-ring member and said sensor member being electrically connected by said at least an external conductive wire. |
地址 |
Hsinchu TW |