发明名称 Structure and fabrication method of a sensing device
摘要 A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.
申请公布号 US9133018(B2) 申请公布日期 2015.09.15
申请号 US200912572277 申请日期 2009.10.02
申请人 Industrial Technology Research Institute 发明人 Chen Lung-Tai;Hsu Yu-Wen;Chen Sheah;Lin Jing-Yuan;Pan Li-Chi;Ho Tzong-Che
分类号 B81B7/00 主分类号 B81B7/00
代理机构 Lin & Associates IP, Inc. 代理人 Lin & Associates IP, Inc.
主权项 1. A structure of a sensing device, comprising: a substrate having an upper surface; a sensor member located at a center area of said upper surface of said substrate; a standing-ring member located on said upper surface of said substrate and surrounding said sensor member; and at least an external conductive wire located on said upper surface of said substrate, said standing-ring member and said sensor member being electrically connected by said at least an external conductive wire.
地址 Hsinchu TW