发明名称 Die-stacked memory device providing data translation
摘要 A die-stacked memory device incorporates a data translation controller at one or more logic dies of the device to provide data translation services for data to be stored at, or retrieved from, the die-stacked memory device. The data translation operations implemented by the data translation controller can include compression/decompression operations, encryption/decryption operations, format translations, wear-leveling translations, data ordering operations, and the like. Due to the tight integration of the logic dies and the memory dies, the data translation controller can perform data translation operations with higher bandwidth and lower latency and power consumption compared to operations performed by devices external to the die-stacked memory device.
申请公布号 US9135185(B2) 申请公布日期 2015.09.15
申请号 US201213726143 申请日期 2012.12.23
申请人 Advanced Micro Devices, Inc. 发明人 Loh Gabriel H.;Beckmann Bradford M.;O'Connor James M.;Ignatowski Michael;Schulte Michael J.;Hsu Lisa R.;Jayasena Nuwan S.
分类号 G06F12/02;G06F12/10 主分类号 G06F12/02
代理机构 代理人
主权项 1. An integrated circuit (IC) package comprising: a die-stacked memory device comprising: a set of one or more stacked memory dies implementing memory cell circuitry; anda set of one or more logic dies electrically coupled to the memory cell circuitry, the set of one or more logic dies coupleable to at least one device external to the die-stacked memory device and comprising a data translation controller and a memory controller, wherein the data translation controller is to perform at least one data translation operation comprising at least one of: a data format translation; a wear-leveling translation; and a data order translation.
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